Dear Kami san

Dear Kami san
You said thar the direction of Sn-Cu alloy plating last meeting :
1. Your company is going to develop Sn-Cu alloy plating chemical that avoid attacking the DF.
2. Your company will improve the ability of Sn-Cu alloy plating for via filling.
3. Your company is going to speed up the Sn-Cu alloy plating rate and the let the film is uniform.

We think the 2nd point is the most important target for us. If we change the percentage of Sn-Cu alloy plating chemical to fit the DuPont’s DF , the DOE test will be done again. As soon as DuPont modify their DF or CUC develop the new additive, we will have to do the test again and again. The DOE test will be large because of the Sn-Cu alloy plating chemical is attacking the DF except GTC-3C. I think, the DF is too weak in acid solution. So, we next step will suggest Nanya san via filling in Cu before Sn-Cu alloy plating.(fig.1) We will test the different dipping time in Sn-Cu alloy plating to make sure the reliability after reflow process.